The endothermic material 5000-9004 features endothermic enthalpy 80J/g, thermal conductivity 0.6W/m.K, low density and high specific heat capacity. It is specially designed for the transmission of heat through the gap. It can fill the gap and transmit the heat between the heating part and the radiator.
• Endothermic enthalpy 80J/g
• Thermal conductivity 0.6W/m.K
• High specific heat capacity
• Easy cutting and shaping
• Low density
PROPERTY |
UNIT |
TEST METHOD |
|
Color |
Black |
- |
Visual |
Thickness |
≥1 |
mm |
ASTM D374 |
Thermal conductivity |
0.6 |
W/MK |
ASTM D5470 |
Endothermic enthalpy |
80 |
J/g |
ASTM D3418 |
Absorption temperature |
58 |
°C |
- |
Specific heat capacity |
2.3 |
J/(g°C) |
- |
Specific gravity |
1.25 |
g/cm3 |
ASTM D792 |
Tensile strength |
≥0.8 |
Mpa |
ASTM D412-1998A |
Working temperature |
-40~105 |
°C |
- |
ELECTRICAL |
|||
Flame rating |
HB |
- |
UL 94 |
Volume resistivity |
≥108 |
Ω-cm |
ASTM D257 |
Breakdown voltage |
≥2 |
KV(DC) |
ASTM D149 |
The endothermic material satisfies the highly integrated heat dissipation requirements from the industries of battery, mobile phone and so on, and is also widely used in memory modules, power modules, power semiconductor devices, solid-state relays, bridge rectifiers, and high-speed buffer memory chips etc..