• Endothermic enthalpy 160J/g
• Thermal conductivity 1.5W/m.K
• High specific heat capacity
• Easy cutting and shaping
• Low density
PROPERTY |
UNIT |
TEST METHOD |
|
Color |
Black |
- |
Visual |
Thickness |
0.2-1 |
mm |
ASTM D374 |
Thermal conductivity |
1.5±0.3 |
W/MK |
ASTM D5470 |
Endothermic enthalpy |
160±10% |
J/g |
- |
Specific heat capacity |
≥2.1 |
J/(g°C) |
- |
Specific gravity |
1.0±0.2 |
g/cm3 |
ASTM D792 |
Working temperature |
-40~100 |
°C |
EM344 |
Phase-transition temperature |
37±1 |
°C |
- |
ELECTRICAL |
|||
Flame rating |
HB |
- |
UL 94 |
Volume resistivity |
≥108 |
Ω-cm |
ASTM D257 |
Breakdown voltage |
≥1500(AC) |
V |
ASTM D149 |
The endothermic material satisfies the highly integrated heat dissipation requirements from the industries of battery, mobile phone and so on, and is also widely used in memory modules, power modules, power semiconductor devices, solid-state relays, bridge rectifiers, and high-speed buffer memory chips etc..